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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

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STD UGRA_Energo

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Update time: 2020-03-16 18:41:40
Creation time: 2019-07-21 16:14:44
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ID Name Designator Footprint Quantity
1 10 R110,R111,R5,R6 1206R 4
2 1u C2,C1,C17,C19,C22,C3 C0805 6
3 AMS1117-3.3 U5 SOT-223 1
4 470u C15 CAP-D8.0XF3.5 1
5 MOC3063M U7 DIP6 1
6 300 R3,R4 0805R 2
7 SRD-05VDC-SL-C RELAY1 RELAY-SL-SRD 1
8 1N4148W D1 SOD-123 1
9 MMBT2222A Q2 SOT23-3 1
10 Header-Male-2.54_1x2 P3,P5,P8,P10,P11 HDR-2X1/2.54 5
11 47 R5,R30 0805R 2
12 4.7k R6,R10,R15,R18,R21,R22,R23,R24,R25,R26,R27,R28,R29 0805R 13
13 3.3k R19,R20,R11,R12,R13,R14,R16,R17 0805R 8
14 Header-Male-2.54_2x5 P7,P1 HDR-5X2/2.54 2
15 DG308-2.54-04P-14-00AH P6 DG308-2.54-04P-14-00AH 1
16 1.5nF C20 1206 1
17 39 R1,R34 1206R 2
18 1u C3,C16,C6,C14 CAP_1206 4
19 IRLML0030TRPBF Q1,Q3 SOT-23(SOT-23-3) 2
20 SS14-E3/61T D4 SMA(DO-214AC) 1
21 KF301-2P X2,X1 KF301-2P 2
22 SMA6J5.0CA D2,D3 SMA_L4.4-W2.6-LS5.0-BI 2
23 NCP3063DR2G U3 SOIC-8_150MIL 1
24 Header-Male-2.54_1x4 H1,H2 DIP-1X4P-2.54MM-M 2
25 NUP2105L D13,D5 SOT-23 2
26 1000uF C7,C4,C18 CAP-D8.0XF3.5 3
27 Header-Male-2.54_1x3 P2,P9 HDR-3X1/2.54 2
28 DG308-03p P4,P12 DG308-2.54-03P-14-00AH 2
29 MAX485CSA+ U6,U9 SOIC-8_150MIL 2
30 DEGSON Screw Terminal 2.54mm 3P U2 DG308-2.54-03P-14-00AH 1
31 KF301-3P X3 KF301-3P 1
32 680uH L1 IND-1207 1
33 CH74-2032LF B1 BATTERYVHOLDER 1
34 3k R8 0805 1
35 1k R9 0805 1
36 0 R2 0805R 1
37 0.15 R7 1206R 1
38 2.2nF C8 0805 1
39 0.1u C10,C11,C12,C13 C0805 4
40 MAX3232EUE+T U4 TSSOP-16 1
41 DS3231SN# U8 SOIC-16_300MIL 1
42 STM32F051R8T6 U1 LQFP-64_10X10X05P 1
43 STM32F072C8T6 U1 LQFP-48_L7.0-W7.0-P0.50-LS9.0-TL 1

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