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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2018-08-29 18:20:09
Creation time: 2018-08-26 06:03:56
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ID Name Designator Footprint Quantity Mounted
1 MAX232DR D1,D2 SOIC-16_150MIL 2 Yes 218857
2 M24C16-WMN6TPI2C D3 SOIC-8_150MIL 1 Yes 32824
3 M95080-WMN6TP D4 SOIC-8_150MIL 1 Yes C41469
4 MAX490ESA+ D5 SOIC-8_150MIL 1 Yes C143503
5 DS1023-2*17SF11 X1 DIP-2X17P-2.54MM 1 Yes C92264
6 DS1023-2*12SF11 X2 HDR-12X2/2.54 1 Yes C92265
7 DS1037 X3,X4 DSUB9-1 2 Yes 8066487125
8 1 µF C3,C11,C1,C4,C2,C6,C7,C8,C9 CASE-A_3216 9 Yes 223029267
9 0.62k R2 0402 1 Yes 9000189652
10 LED-Green(0603) LED3,LED4 LED-0603 2 Yes 9201T053
11 1k R5,R6,R7,R8,R9,R10,R11,R12,R1 0402 9 Yes 9000189652
12 TS6601 SW2 KLS7-TS6601 1 Yes COM-08720
13 1k R13 0402 1 Yes
14 ECH381RM-04P CN1 DIP-1X4PW-3.81MM 1 Yes C126282
15 Header-Male-2.54_1x15 H1,H2,H3 DIP-1X15P-2.54MM-M 3 Yes C124373

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