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2.The process supports design scales of 300 devices or 1000 pads

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD kzs_mez_new

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Update time: 2020-10-22 18:26:48
Creation time: 2019-01-24 13:52:11
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ID Name Designator Footprint Quantity BOM_Supplier Part BOM_Supplier
1 RECOM RKE-0505S/H U1 RECOM RKE-0505S/H 1 919-RKE-0505S/H Mouser
2 LED-Green(0603) LED3,LED4 LED-0603 2 9201T053 chipdip.ru
3 DS1023-2*12SF11 X2 HDR-12X2/2.54 1 C92265 chipdip.ru
4 MAX232DR D1,D2 SOIC-16_150MIL 2 218857 terraelectronica.ru
5 0.62k R2 0402 1 9000189652 chipdip.ru
6 1k R5,R6,R7,R8,R9,R10,R11,R12,R1,R13 0402 10 9000189652 chipdip.ru
7 TS6601 SW2 KLS7-TS6601 1 COM-08720 SparkFun
8 MAX490ESA+ D5 SOIC-8_150MIL 1 C143503 chipdip.ru
9 DS1037 X3,X4 DSUB9-1 2 8066487125 chipdip.ru
10 ECH381RM-04P CN1 DIP-1X4PW-3.81MM 1 C126282 LCSC
11 M24C16-WMN6TPI2C D3 SOIC-8_150MIL 1 32824 terraelectronica.ru
12 1 µF C3,C11,C1,C4,C2,C6,C7,C8,C9 CASE-A_3216 9 223029267 chipdip.ru
13 Header-Male-2.54_1x15 H1,H2,H3 DIP-1X15P-2.54MM-M 3 C124373 LCSC
14 M95080-WMN6TP D4 SOIC-8_150MIL 1 C41469 chipdip.ru
15 DS1023-2*17SF11 X1 DIP-2X17P-2.54MM 1 C92264 chipdip.ru

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