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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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STD H_Bridge copy
Mode: Editors' pick
Cloned from H_Bridge
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Update time：
2019-12-10 11:32:11
Creation time：
2019-12-10 11:30:51
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | BC547B | Q1,Q2 | TO-92_3PIN-L4.95-W3.94-PITCH2.54-L | 2 |
| 2 | Header-Male-2.54_1x4 | IN1 | DIP-1X4P-2.54MM-M | 1 |
| 3 | 220u | C1 | CAP-D8.0XF3.5 | 1 |
| 4 | BZX55C5V1 | ZD1 | DO-35_BD2.0-L4.0-P8.00-D0.5-FD | 1 |
| 5 | EVQ22705R | SW2,SW1 | KEY-6.0*6.0-4 | 2 |
| 6 | TLE5205-2 | IC1 | P-TO220-7-11 | 1 |
| 7 | Header-Male-2.54_1x5 | H2,H1 | DIP-1X5P-2.54MM-M | 2 |
| 8 | 27k | R4,R2 | AXIAL-0.4 | 2 |
| 9 | 680 | R7 | AXIAL-0.4 | 1 |
| 10 | 10k | R3,R5 | AXIAL-0.4 | 2 |
| 11 | 10 | R1 | AXIAL-0.4 | 1 |
| 12 | 270 | R6 | AXIAL-0.4 | 1 |
| 13 | GRN 3mm | LED1 | LED-3MM/2.54 | 1 |
| 14 | 10uF | C6,C5 | RAD-0.2 | 2 |
| 15 | 10n | C2 | RAD-0.2 | 1 |
| 16 | 82n | C3,C4 | RAD-0.2 | 2 |
| 17 | TP | TP8,TP3,GND | 1X01 | 3 |
| 18 | test | TP2,TP1 | 1X01 | 2 |
| 19 | Header-Male-2.54_1x2 | HM2,PWR2,HM1,PWR | HDR-2X1/2.54 | 4 |
| 20 | LM337T | U1 | LM340 | 1 |
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