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Zadanie1

1 month ago 23
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Description

:)

Documents

Sheet_1

PCB_2020-10-13_12-39-43

PCB_2020-10-14_14-26-14

PCB_2020-10-15_14-22-55

PCB_2020-10-16_15-19-57

PCB_2020-10-17_10-52-49

BOM

ID Name Designator Footprint Quantity
1 1uF C3 CAP-TH_L4.5-W3.0-P5.00-D1.2 1
2 HDR-F-2.54_1x2 H1,H2 HDR-F-2.54_1X2 2
3 2N5551 Q1 TO-92-3_L4.9-W3.7-P1.27-L 1
4 LM358NG U1 DIP-8_L9.7-W6.4-P2.54-LS7.6-BL 1
5 300K R3,R4 RES-TH_BD2.4-L6.3-P10.30-D0.6 2
6 13K R6 RES-TH_BD2.2-L6.5-P10.50-D0.9 1
7 5K R2 RES-ADJ-TH_R09-B502-3P_6MM 1
8 180K R11 RES-TH_BD2.4-L6.3-P10.30-D0.6 1
9 910K R8,R7 RES-TH_BD2.4-L6.3-P10.30-D0.6 2
10 IRF7815PBF U3 SOIC-8 1
11 220nF C2 CAP-TH_L6.5-W4.0-P5.00-D1.0 1
12 100nF C1 CAP-TH_L5.0-W2.5-P2.54-D0.7 1
13 620 R10 RES-TH_BD2.4-L6.3-P10.30-D0.6 1
14 7.5K R12 RES-TH_BD2.4-L6.3-P10.30-D0.6 1
15 XY302V-3.5-2P U4 CONN-TH_XY302V-3.5-2P 1
16 LMC555CN U2 DIP8 1
17 27K R5 RES-TH_BD2.4-L6.3-P10.30-D0.6 1
18 15K R1 RES-TH_BD2.4-L6.3-P10.30-D0.6 1
19 10KΩ NTC RES-TH_L6.0-W3.0-P2.54-D0.6 1

Attachments

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Members

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