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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2020-08-16 19:35:49
Creation time: 2020-07-02 07:40:23
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ID Name Designator Footprint Quantity
1 10k R23,R22,R21,R24 R1206 4
2 160K R15,R14,R13,R16 R1206 4
3 1K R9,R10,R11,R12 1206 4
4 DC DC1 DC-5020 1
5 MAX6025AEUR+T U5 SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR 1
6 3.3K R31,R25,R29,R30 R1206 4
7 NOKIA-5110 U6 NOKIA-5110 1
8 100k R2,R3,R1,R4 R1206 4
9 HM-187 U4 HW-187 DC/DC BUCK CONVERTER 1
10 LM358PW U3,U1 SOIC-8_L5.0-W4.0-P1.27-LS6.0-TL 2
11 arduino_nano U2 ARDUINO_NANO1 1
12 Micro_Match_6pol_Female JP1,JP6,JP5,JP4,JP3,JP7,JP8,JP2 MICRO_MATCH_6POL_FEMALE 8
13 20K R20,R17,R19,R18 C0805-RES 4
14 2.2nF C5,C7,C8,C6 0805 М 4
15 Female header/2.54mm2x3 Female header H2,H1,H4,H3 HDR-TH_6P-P2.54-V-R2-C3-S2.54 4
16 SHUNT R32,R28,R27,R33 SMS-WAV 4
17 DIODE-MINIMELF D8,D7,D6,D5 MINIMELF 4

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