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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2020-01-10 15:08:16
Creation time: 2019-03-11 07:41:45
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ID Name Designator Footprint Quantity
1 10K RN1,RN2,RN3,RN4 0603_X4 4
2 10uF C13 CAP-T7343-D 1
3 MF-MSMF010-2 F1,F2 F1812 2
4 1.2K R1 0805 1
5 ZL201-02G CON1 ZL201-02G 1
6 74HC244D,653 U12 SOIC-20_300MIL 1
7 18pF C9,C10 0805 2
8 25MHz X2 HC-49S 1
9 12MHz X4 OSC-49U-1 1
10 74LVC1G125GV,125 U14,U15,U16,U7,U10 SOT-753 5
11 470pF C1 0805 1
12 TJA1040T/CM,118 U8 SOIC-8_150MIL 1
13 1MΩ R4 0805 1
14 ATMEGA2560-16AU U1 TQFP-100_14X14X05P 1
15 2N7002 Q1 SOT-23(SOT-23-3) 1
16 SMAJ10A-13-F D8 SMA_L4.3-W2.6-LS5.2-RD 1
17 10K R15,R14,R16,R17,R7 0805 5
18 600Ω L2,L3 1206 2
19 ES2BA-13-F D2,D4,D5,D6 DO-214AC_L4.3-W2.7-LS5.3-RD 4
20 MAX485CSA+ U3 SOIC-8_150MIL 1
21 W5500 U2 LQFP-48_7X7X05P 1
22 HR911105A RJ451 RJ45-LIGHT 1
23 SS12 D1 SMA(DO-214AC) 1
24 AMS1117-3.3 U11 SOT-223 1
25 10 R10 0805 1
26 60 Om R5,R6 0805 2
27 P6AU-0505ELF U6 R_ARRAY_SIP4 1
28 16MHz X3 3213 1
29 ADUM1401ARWZ-RL U26,U27 SOIC-16_300MIL 2
30 102K ±10% 2KV C15 CAP-HV-5.0*4.0 1
31 49.9 RN5 0603_X4 1
32 100uF C4 CAP-D6.3XF2.5 1
33 10nF C8,C21 0805 2
34 MC34063 U4 SOP-8 1
35 665 R11 R0805 1
36 CH340G U5 SOIC-16_150MIL 1
37 100nF C2,C3,C11,C12,C14,C16,C22,C23,C24,C26,C27,C28,C29,C30,C31,C32,C33,C34,C35,C36,C37,C38,C39,C40,C41 0805 25
38 3.6K R2 0805 1
39 6.8nF C17,C18 0805 2
40 470uF C5 CAP-D6.3XF2.5 1
41 4.7uF C20 1206 1
42 220uH L1 IND-1206 1
43 SM712.TCT D3 SOT-23(SOT-23-3) 1
44 22pF C6,C7 0805 2
45 330 R8,R9 0805 2
46 DG141V-2.54-8P U13,U17,U18,U19,U20,U21,U22,U23,U24,U25 DG141V-2.54-8P 10
47 SMAJ6.5A-13-F D7 SMA_L4.3-W2.6-LS5.2-RD 1
48 ST-TF-003A SD1 MICRO-SD9+4P-SMD-16.1X14.5X1.85MM 1
49 DC005-2.0MM DC1 DC-5020 1
50 0.33 R3 2512 1
51 10uF C25 1210 1
52 ESP32-S U9 ESP32-S 1
53 22nF C19 0805 1
54 12.4K 1% R18 0805 1
55 PN61729-S X1 PN61729-S 1

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