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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2019-12-20 17:15:04
Creation time: 2019-02-15 04:51:51
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ID Name Designator Footprint Quantity
1 PIC16F877A-I/P U1 DIP-40 1
2 10k R1 AXIAL-0.3 1
3 1k R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R12,R13,R14,R15,R16,R17,R18 AXIAL-0.3 17
4 8MHZ X1 OSC-S49S 1
5 c1 .22PF RAD-0.1 1
6 c2 0.22PF RAD-0.1 1
7 BARRA DE PINOS 6x1 PICKIT BARRA_PINOS7X2 1
8 LM7805CT REG TO-220(TO-220-3) 1
9 .1uF C2IN,C3IN CAP-CT4G-0805-5.08MM 2
10 Reset SW1 6X6 MM PUSH BOTTON 1
11 STOP SW2 6X6 MM PUSH BOTTON 1
12 ELECTRO1 1 WJ15EDGVC-3.81-2P 1
13 ELECTRO2 2 WJ15EDGVC-3.81-2P 1
14 ELECTRO3 3 WJ15EDGVC-3.81-2P 1
15 ELECTRO4 4 WJ15EDGVC-3.81-2P 1
16 ELECTRO5 5 WJ15EDGVC-3.81-2P 1
17 IN VOLT INPUT12V WJ15EDGVC-3.81-2P 1
18 STOPBOTT STOPBOTT,OUTRESET WJ15EDGVC-3.81-2P 2
19 REG VOLT REGVOLTAJE,SWITCHSTOP WJ15EDGVC-3.81-2P 2
20 BLUE IR1,IR2,IR3,IR4,IR5 IR-5MM/2.54 5
21 MAX232ESE+T U2 SOIC-16_150MIL 1
22 DB9FEMALE JP1 DB9 1
23 100nF C1 RAD-0.1 1
24 1u C2,C3,C4 RAD-0.1 3
25 2N2222A Q1,Q2,Q3,Q4,Q5 TO-92(TO-92-3F)-2.54 5

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