© 2024 EasyEDA Some rights reserved ISO/IEC
1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD low_cap_probe
License: Public Domain
Mode: Editors' pick
ID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | SLDRPNT | SLDRPNT | SOLDER_POINT_1.5MM_TWIN MILL_PADS | 1 |
2 | BNC | OUTCON | BNC_FAKE MILL_PADS | 1 |
3 | 10M | R1 | R020710_MILL_PADS | 1 |
4 | 9M | R2 | R020710_MILL_PADS | 1 |
5 | TZ03Z070E169 | C2 | TZ03 MILL_PADS | 1 |
6 | 1p8 | C1 | 0805_MILL_PADS | 1 |
7 | Grounds Connection | GNDS1,GNDS2 | GROUNDS CON_MILL_PADS | 2 |
8 | Header 1*1P | GNDCN1,GNDCN2 | GROUNDS LINK_MILL_PADS | 2 |
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