© 2024 EasyEDA Some rights reserved ISO/IEC
1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD redux_3ch_12v_to_5v
Mode: Editors' pick
ID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | PC817B | U3_1,U1_1,U2_1 | DIP4_MILL_PADS | 3 |
2 | +12V Supply | P5 | CWF-2(DS1069)_MILL_PADS | 1 |
3 | 750 | R1_1,R2_1,R3_1 | 0309V_MILL_PADS | 3 |
4 | 3.3k | R1_2,R2_2,R3_2 | 0309V_MILL_PADS | 3 |
5 | Y-axis Switch | P2 | WF-3(DS1070)_MILL_PADS | 1 |
6 | Z-axis Switch | P3 | WF-3(DS1070)_MILL_PADS | 1 |
7 | SN74LVC1G04DBV | U1_2,U2_2,U3_2 | SOT23-5_MILL_PADS | 3 |
8 | .1u | C1,C2,C3 | C025-025X050_MILL_PADS | 3 |
9 | X-axis Switch | P1 | WF-3(DS1070)_MILL_PADS | 1 |
10 | MOUNT-HOLE3.2 | H1,H2,H3,H4 | MOUNT HOLE_MILL_PADS | 4 |
11 | Grounds Con +5V | H5 | GROUNDS CON_MILL_PADS | 1 |
12 | Grounds Con +12V | H6 | GROUNDS CON_MILL_PADS | 1 |
13 | Grounds Link +5V | P7 | GROUNDS LINK_MILL_PADS | 1 |
14 | Grounds Link +12V | P8 | GROUNDS LINK_MILL_PADS | 1 |
15 | Output | P6 | WF-5(DS1070)_MILL_PADS | 1 |
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