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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD BT_v3

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Update time: 2019-10-15 19:00:50
Creation time: 2019-10-15 17:58:17
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Manufacturer BOM_Manufacturer Part BOM_Supplier Part
1 SN74LVC1G14DBVR U1,U2 SOT-23-5_L3.0-W1.7-P0.95-LS2.8-BL 2 LCSC TI SN74LVC1G14DBVR C7835
2 100K R2,R3 0805 2 LCSC UniOhm 0805W8F1003T5E C17407
3 470K R1 0805 1 LCSC YAGEO RC0805JR-07470KL C137427
4 1uF C2,C1,C3,C4,C5 0805 5 LCSC MuRata GRM21BR71C105KA01L C77079
5 3.3V P1 HDR-1X1/2.54 1 LCSC ReliaPro Header-Male-2.54_1x1 C81276
6 GND P3 HDR-1X1/2.54 1 LCSC ReliaPro Header-Male-2.54_1x1 C81276
7 POWER_EN P2 HDR-1X1/2.54 1 LCSC ReliaPro Header-Male-2.54_1x1 C81276
8 10K R4 0805 1 LCSC EVER OHMS QR0805J10KP05 C149881
9 BAT54A D1 SOT-23(SOT-23-3) 1 LCSC CJ BAT54A C8591

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