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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD MPU ESP AMS final

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Update time: 2020-07-11 14:27:21
Creation time: 2020-03-17 19:40:38
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ID Name Designator Footprint Quantity
1 10pF C1,C2 0805 2
2 SK-12D02-VG5 SW3 DIP-8.6X4.4 1
3 22uF C14 CAP-D4.0XF1.5 1
4 AT25SF161-SHD-T U3 SOIC-8_L5.3-W5.3-P1.27-LS8.0-BL 1
5 8.2pF C5 0805 1
6 1.5nH L1 L0805 1
7 MPU6050 U4 QFN50P400X400X95-25T265X275N 1
8 FC-2012UGK-520D5 LED2,LED1 LED-0805 2
9 2.2nF C13 0805 1
10 AMS1117-3.3 U2 SOT-223 1
11 ANTENNA_pcb_2.4 ANT1 RN-ANT 1
12 XH2.54-4AW CN1 XH2.54-4AW 1
13 K2-6639SP-I4SC-04 RST,PRG,SWE K2-6639SP-I4SC-04 3
14 26MHz X2 OSC-YSX-3225_4P 1
15 XH-2AW CN2 XH-2AW 1
16 MBR0530 D1 SOD-123 1
17 10uF C4 0805 1
18 12K R1 0805 1
19 4.7K R4,R3,R6,R8,R9,R10,R7 0805 7
20 200 R2,R5,R11 0805 3
21 100uF C9 CAP-D5.0XF2.0 1
22 2.4GHz U1 QFN-32_L5.0-W5.0-P0.50-TL-EP 1
23 2.5pF C7 0805 1
24 100nF C3,C11 0805 2
25 10nF C12 0805 1

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