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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

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STD ESP32

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Update time： 2022-01-16 09:44:38
Creation time： 2018-10-06 15:38:16
Description
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Design Drawing
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BOM
BOM download Purchase Parts
ID Name Designator Footprint Quantity
1 RXM590 P2 HDR-1X2/2.54 1
2 TX590 P3 HDR-1X2/2.54 1
3 AO3400 Q3 SOT-23(SOT-23-3) 1
4 BC846B Q1,Q2 SOT-23(SOT-23-3) 2
5 SIM-008 CARD2 SIM-SMD_SIM-08A 1
6 10k R7,R8,R9,R10,R13 0603 5
7 470 R12 0603 1
8 0.4 R14 2512 1
9 1k R15,R16,R21 0603 3
10 4.7k R24 0603 1
11 47uF C8 CAP-D4.0XH5.5 1
12 100pF C7 1206 1
13 NRF24L01+ MK1 NRF24L01+ 1
14 SS14 D5,D8 SMA(DO-214AC) 2
15 Header-Male-2.54_1x7 P1 HDR-8X1/2.54 1
16 AMS1117-3.3_C165482 U3 SOT-223 1
17 KEY SW1 KEY-6.0X6.0X5.0 1
18 1000uF C9 CAP-D10.0XF5.0 1
19 100Ω R3 0603 1
20 47KΩ(4702) R19,R22 0603 2
21 6*6*12SMD SW3 KEY-6.0*6.0 1
22 0.1mF C2 0603 1
23 10u C5,C6 0603 2
24 push_button S1 5.8*5.8_LATCHING_SWITCH 1
25 LM317D2T-TR U4 TO-263-2-ON-LM317BD2TG 1
26 200Ω(201) R18 0603 1
27 1u C10,C11 0805 2
28 ESP-12F(ESP8266MOD) U1 ESP-12F(ESP8266MOD) 1
29 LM358PSR U2 SOIC-8_208MIL 1
30 DC DC1 DC-5020 1
31 10KΩ(1002) R2,R17,R20,R23,R4 0603 5
32 470Ω R1 0603 1
33 470Ω(471) R6 0603 1
34 Batary X1 AKL701_2_13 1
35 DCDC IN X2 AKL701_2_13 1
36 DCDC OUT 5V X3 AKL701_2_13 1
37 M590 U6 M590 1
38 SR24 D4,D3,D6,D7 SMB 4
39 TP4056 U5 SOP-8_EP_150MIL 1

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