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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD GSM_Modul_se_sim800l

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Update time: 2020-01-03 13:19:45
Creation time: 2019-08-26 10:49:26
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ID Name Designator Footprint Quantity
1 ARDUINO_NANO U2 ARDUINO_NANO 1
2 SIM800L SIM1L SIM800L 1
3 stepdown_18*11 U1,U3 STEPDOWN 18*11 2
4 2k R1 AXIAL-0.3 1
5 4k7 R2 AXIAL-0.3 1
6 1u C1,C2 CAP-D3.0XF1.5 2
7 KF301 LOGICKE_VSTUP1 KF301 1
8 SIP-1A05 K2,K1,K3,K4,K5,K6,K7,K8,K9 RELAY-TH_4PIN_SIP-1A05 9
9 IRF520PBF Q1,Q2,Q3,Q4,Q5,Q6,Q7,Q8,Q9 TO-220(TO-220-3) 9
10 100k R3,R4,R5,R6,R7,R8,R9,R10,R11 AXIAL-0.3 9
11 1N4148W D1,D2,D3,D4,D5,D6,D7,D8,D9 DIODE 9
12 MF350 U5,U6,U7,U4,U8,U9,UART MF350 SCREW CONNECTOR 7
13 10k R12,R13,R14 AXIAL-0.3 3

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