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2.The process supports design scales of 300 devices or 1000 pads

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STD T12+858D

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Update time: 2021-12-04 04:18:03
Creation time: 2020-03-01 03:15:14
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ID Name Designator Footprint Quantity
1 100n C12,C10,C4,C5,C6,C3,C7 C0805 7
2 AT24C32A U5 SO08-8S1 1
3 18v VD1,VD3 DO-41_BD2.4-L4.7-P8.70-D0.9-FD 2
4 FR107 D1,D2 SMA_FR107 2
5 IRF9540 VT2,VT4 IRF9540TP 2
6 SPI-OLED U8 OLED-128X64_SPI 1
7 500k R5,R19 RES-ADJ-TH_3362P 2
8 buzzer BZ1 蜂鸣器 1
9 MA04-1 ENCODER MA04-1 1
10 2N2222 VT1,VT5,VT3 SOT-23-3_L2.9-W1.3-P1.90-LS2.4-TR 3
11 3.3k R30,R29 R0805 2
12 10k R6,R7,R13,R1,R16,R26,R20,R21 R0805 8
13 470 R4,R10,R18,R23 R0805 4
14 1k R8,R12,R3,R31,R17,R25,R22,R38 R0805 8
15 3.3v VD2 SMA_FR107 1
16 100k R11,R41,R14,R40,R39,R42,R28,R24 R0805 8
17 0.05, 1W R9 R2512 1
18 100 R2,R32,R15 R0805 3
19 IRON JP1 1X02 1
20 Amb+tilt JP5 2.54-4 1
21 0.5 1W R27 R2512 1
22 4N25M OK1 4N25 1
23 MOC3052 OK2 OPTO-SMD_MOC3052SR2M 1
24 BTA41 600B T1 TOP3_L15.3-W4.5-P5.60-L 1
25 39, 1W R35 R2512 1
26 0.01uF/600V C11 CAP-TH_L12.5-W7.7-P10.00-D0.6 1
27 Power (220v) JP3 KF301-5.08-2 1
28 gun heater JP4 KF301-5.08-2 1
29 DB207 B1 B-DIL 1
30 330 R36 R0805 1
31 220 R37 R0805 1
32 33k R33,R34 R0805 2
33 AUX1 P3 1X02 1
34 Header-Male-2.54_1x4 P1 2.54-4 1
35 Heatsink HS1 HEATSINK TO-3_FJ51 1
36 10M R44 R0805 1
37 470u C2,C1 CAP-D8.0XH10.5 2
38 2596S DC-DC U9 2560S DC-DC 1
39 Header-Male-2.54_1x5 H1 DIP-1X5P-2.54MM-M 1
40 1u C13 C0805 1
41 22pf C8,C9 C0805 2
42 KF301-5.08-2P P2 KF301-5.08-2 1
43 8MHZ X1 贴片晶振 1
44 REG1117-3.3 U7 SOT-223-4_L6.5-W3.5-P2.30-LS7.0-BR 1
45 STM32F103C8T6 U1 LQFP-48_7X7X05P 1
46 AD823ARZ-R7 U2 SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL 1
47 LM358-SR U3 SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL 1

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