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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD ESP_MCP

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Update time: 2021-04-12 15:26:07
Creation time: 2018-10-09 08:04:45
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ID Name Designator Footprint Quantity
1 10k R1,R2,R3,R4 AXIAL-0.3 4
2 100 R5,R6,R7 AXIAL-0.3 3
3 1k R8,R9,R10 AXIAL-0.3 3
4 IO H9 DIP-1X4P-2.54MM-M 1
5 IO-GND H10 DIP-1X4P-2.54MM-M 1
6 IO-VCC H11 DIP-1X4P-2.54MM-M 1
7 Conv P1 HDR-3X1/2.54 1
8 IRLML6244TRPBF Q1,Q2,Q3 SOT-23(SOT-23-3) 3
9 ESP-12F(ESP8266MOD) U1 ESP-12F(ESP8266MOD) 1
10 MCP23017SP U2 DIP28-300 1
11 Input H1 210S-1X8P 1
12 Input-G H2 210S-1X8P 1
13 Input-VCC H3 210S-1X8P 1
14 Output H4 210S-1X8P 1
15 Output-G H5 210S-1X8P 1
16 OUT-0 H6 HDR-2X1/2.54 1
17 OUT-3 H7 HDR-2X1/2.54 1
18 OUT-7 H8 HDR-2X1/2.54 1
19 ADC H12 HDR-2X1/2.54 1
20 RX/TX H13 HDR-2X1/2.54 1
21 I2C H14 HDR-2X1/2.54 1
22 RST H15 HDR-2X1/2.54 1
23 IO2 H16 HDR-2X1/2.54 1
24 5V In H17 HDR-2X1/2.54 1
25 5V H18,H19 HDR-2X1/2.54 2
26 3V3 H20,H21 HDR-2X1/2.54 2

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