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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD DCMesuV1.2

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Update time: 2020-07-10 23:49:59
Creation time: 2020-05-03 02:37:10
Description
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ID Name Designator Footprint Quantity
1 16MHz Y1 3213 1
2 10k R100 R0603 1
3 ATMEGA328_TQFP U4 TQFP32 1
4 100nF C1,C8,C3,C5,C6,C7,C9,C11,C12,C13,C14 C0603 11
5 Yellow LED D1 LED 0603 1
6 1k R101,R22,R21 R0603 3
7 10uF C4 C0603 1
8 12MHz Y2 3213 1
9 CH340G U5 SOIC-16_150MIL 1
10 NO P1 MICRO-USB-4 1
11 SS13 D5 SMA(DO-214AC) 1
12 1M R1,R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R12,R13,R14,R15,R16,R17,R18,R19,R20,R23,R24,R25,R26 R0603 24
13 HDR2X3 ICSP1 HDR2X3 1
14 10uF C10,C2 CAP-TH_BD6.3-P2.50-D1.0-FD 2
15 AMS1117-5.0_C351787 U7 SOT-223_L6.5-W3.5-P2.30-LS7.0-BR 1
16 LD1117S33CTR U6 SOT-223-4_L6.5-W3.5-P2.30-LS7.0-BR 1
17 LM358S_C329454 U1,U2,U3 SOP-8_L5.0-W4.0-P1.27-LS6.0-BL 3
18 M7F_C466485 D3 SMAF_L3.5-W2.6-LS4.7-RD 1
19 B4B-XH-2 (LF)(SN) CN2 CONN-TH_B4B-XH-2 (LF)(SN) 1
20 SMD1210-075 F17 F1210 1
21 DB2ERC-3.81-2P CN3,CN1,CN4,CN5 CONN-TH_2P-P3.81_DB2ERC-3.81-2P 4
22 A2541HWV-4P H1 HDR-TH_4P-P2.54-V_A2541HWV-4P 1

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