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2.The process supports design scales of 300 devices or 1000 pads

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STD 8 Ch ESP8266

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Update time: 2021-07-21 10:55:18
Creation time: 2018-07-23 16:46:52
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ID Name Designator Footprint Quantity
1 5VDC RELAY1,RELAY2,RELAY3,RELAY4,RELAY5,RELAY6,RELAY7,RELAY8 RELAY-SL-SRD 8
2 ULN2803A_C181731 U4 SOIC-18_L11.6-W7.5-P1.27-LS10.3-BL 1
3 AC 230V P9 WJ300V-5.00-2P 1
4 WEMOS U1 WEMOS MINI D1 1MM HOLES 1
5 FC-2012UGK-520D5 LED10,LED11,LED12,LED13,LED14,LED15,LED16,LED17,LED18 LED0805-FD 9
6 HLK-PM01 U3 HLK-PM01 1
7 1N4001F D9,D10,D11,D12,D13,D14,D15,D16 SMAF_L3.5-W2.6-LS4.7-RD 8
8 150 R10,R11,R12,R13,R14,R15,R16,R17,R1 R0805 9
9 WJ300V-5.0-3P P1,P2,P3,P4,P5,P6,P7,P8 WJ300V-5.00-3P 8

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