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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2019-09-27 16:40:07
Creation time: 2019-09-24 16:33:32
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ID Name Designator Footprint Quantity
1 5x20 5A F1 5X20-BLX-A 1
2 LM350T U1 TO-220(TO-220-3) 1
3 220 R1 1206 1
4 1N4007 D3,D4,D2,D1,D5,D9,D8,D6,D7,D10,D11 DO-41 11
5 R SOL 1 K1 RELAY-SL-MI 1
6 R SOL 2 K2 RELAY-SL-MI 1
7 R FN K3 RELAY-SL-MI 1
8 R CUENTA K4 RELAY-SL-MI 1
9 47 R3 1206 1
10 500 R2 RES-ADJ_3386P 1
11 10k R11,R8 1206 2
12 470 R4,R6,R5 1206 3
13 D CUENTAMETROS LED6 LED-SMD-3.2X1.6X1.1 1
14 820 R13,R7,R14 1206 3
15 sensor I SENSORI WJ2EDGVC-5.08-3P 1
16 WJ2EDGVC-5.08-2P SOLFN,POTEXT,SOL1T,SOL2S,DCCM,ALIMENTACION WJ2EDGVC-5.08-2P 6
17 WJ2EDGVC-5.08-3P JOY WJ2EDGVC-5.08-3P 1
18 Resta SUMA WJ2EDGVC-5.08-2P 1
19 2200uF C1,C4 CAP-D6.3XF2.5 2
20 SOL FN LED4 LED-SMD-3.2X1.6X1.1 1
21 SOL 1 LED3 LED-SMD-3.2X1.6X1.1 1
22 SOL 2 LED2 LED-SMD-3.2X1.6X1.1 1
23 +12V LED1 LED-SMD-3.2X1.6X1.1 1

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