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TDA8924

1 month ago 10
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Description

Documents

Esquema

PCB

BOM

ID Name Designator Footprint Quantity
1 47uF C40 CAP-TH_BD5.0-P2.00-D0.8-FD 1
2 3.9K R16 1206 1
3 MMSZ5232B-7-F D1 SOD-123_L2.8-W1.8-LS3.7-RD 1
4 47pF C33 0805 1
5 1.5mF C41 CAP-TH_BD10.0-P5.00-D1.0-FD 1
6 330pF C21,C20 0805 2
7 TDA8924 U1 HSOP24 1
8 47uF C3,C4,C5 CAP-TH_BD8.0-P3.50-D1.0-FD 3
9 5K R15 RES-ADJ_3362P 1
10 LM2575S-ADJ U2 TO-263-5 1
11 220nF C28,C29,C9,C8,C32,C35,C14,C10,C38 1206 9
12 1uF C26,C27 CAP-TH_L7.2-W6.0-P5.00-D0.6 2
13 1x3 H1,H3,H2 HDR-TH_3P-P2.54-V 3
14 1N5819 D2 SOD-123_L2.8-W1.8-LS3.7-FD 1
15 1000uF C1,C2 CAP-TH_BD12.5-P5.00-D1.2-FD 2
16 10K R1,R2 1206 2
17 39K R4,R3 1206 2
18 150uH L7 IND-606028 1
19 C2P P2,P3 CONN-TH_2PIN-V-PITCH5.00-L_JL126-50002G01 2
20 15nF C22,C23,C30,C31 0805 4
21 22 R12,R13 2512 2
22 30K R5 1206 1
23 4.7 R10,R11 1206 2
24 5.6K R6,R7,R8,R9 1206 4
25 470nF C16,C17,C18,C19 CAP-TH_L7.2-W4.5-P5.00-D0.6 4
26 1.2K R14 1206 1
27 REL K1 HTD2-DC24V-SHG 1
28 BL01RN1A1 L1,L2,L3,L4 BEAD-TH_BD3.6-L5.0-P9.00-D0.7 4
29 PJ-313D_C319112 JACK PHONE-JACK-5P-6.0X12.5-H5.0 1
30 100nF C6,C7,C36,C34,C15,C13,C11,C12,C37,C39 1206 10
31 10uH L6,L5 IND-SMD_L13.8-W12.6_MHCC12050 2
32 C3P P1 WJ126V-5.0-3P 1
33 560pF C24,C25 0805 2

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你现在访问的是EasyEDA海外版,使用建立访问速度更快的国内版 https://lceda.cn(需要重新注册)
如果需要转移工程请在个人中心 - 工程 - 工程高级设置 - 下载工程,下载后在https://lceda.cn/editor 打开保存即可。
有问题联系QQ 3001956291 不再提醒
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