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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD TDA8924

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Update time: 2023-03-03 16:13:33
Creation time: 2019-10-25 22:12:04
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ID Name Designator Footprint Quantity
1 1000uF C1,C2 CAP-TH_BD12.5-P5.00-D1.2-FD 2
2 47uF C3,C4,C5 CAP-TH_BD8.0-P3.50-D1.0-FD 3
3 100nF C6,C7,C11,C12,C13,C15,C34,C36,C37,C39 1206 10
4 220nF C8,C9,C10,C14,C28,C29,C32,C35,C38 1206 9
5 470nF C16,C17,C18,C19 CAP-TH_L7.2-W4.5-P5.00-D0.6 4
6 330pF C20,C21 0805 2
7 15nF C22,C23,C30,C31 0805 4
8 560pF C24,C25 0805 2
9 1uF C26,C27 CAP-TH_L7.2-W6.0-P5.00-D0.6 2
10 47pF C33 0805 1
11 47uF C40 CAP-TH_BD5.0-P2.00-D0.8-FD 1
12 1.5mF C41 CAP-TH_BD10.0-P5.00-D1.0-FD 1
13 MMSZ5232B-7-F D1 SOD-123_L2.8-W1.8-LS3.7-RD 1
14 1N5819 D2 SOD-123_L2.8-W1.8-LS3.7-FD 1
15 1x3 H1,H2,H3 HDR-TH_3P-P2.54-V 3
16 PJ-313D_C319112 JACK PHONE-JACK-5P-6.0X12.5-H5.0 1
17 REL K1 HTD2-DC24V-SHG 1
18 BL01RN1A1 L1,L2,L3,L4 BEAD-TH_BD3.6-L5.0-P9.00-D0.7 4
19 10uH L5,L6 IND-SMD_L13.8-W12.6_MHCC12050 2
20 150uH L7 IND-606028 1
21 C3P P1 WJ126V-5.0-3P 1
22 C2P P2,P3 CONN-TH_2PIN-V-PITCH5.00-L_JL126-50002G01 2
23 10K R1,R2 1206 2
24 39K R3,R4 1206 2
25 30K R5 1206 1
26 5.6K R6,R7,R8,R9 1206 4
27 4.7 R10,R11 1206 2
28 22 R12,R13 2512 2
29 1.2K R14 1206 1
30 5K R15 RES-ADJ_3362P 1
31 3.9K R16 1206 1
32 TDA8924 U1 HSOP24 1
33 LM2575S-ADJ U2 TO-263-5 1

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