© 2024 EasyEDA Some rights reserved ISO/IEC
1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD DS18B20 wemos
Mode: Editors' pick
Cloned from DS18B20 exp
ID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | 22uF | C1,C2,C4 | CAP-SMD_BD5.0-L5.3-W5.3-FD | 3 |
2 | 100n | C3 | C1206 | 1 |
3 | KF2EDGV-3.5-3P | CN1,CN2,CN3,CN4,CN5,CN6,CN7,CN8 | CONN-TH_3P-P3.50_KF2EDGV-3.5-3P | 8 |
4 | E6C0805 | LED1,LED2 | LED0805-R-RD | 2 |
5 | 3k9 | R1 | R1206 | 1 |
6 | 270 | R2,R3 | R1206 | 2 |
7 | MC7805BDTG | U1 | DPAK_L6.5-W6.0-P2.29-LS9.9-BR | 1 |
8 | WEMOS-S2-MINI + D1 MINI ESP32 + WEMOS D1 MINI ESP8266 (TRI FOOTPRINT) | U2 | WEMOS-S2-MINI/ESP32 D1 MINI/D1 ESP8266 | 1 |
9 | MTP125-1104S1 | U3 | HDR-TH_4P-P2.54-V-M | 1 |
Unfold
Loading...
Do you need to add this project to the album?