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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD P4_head

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Update time: 2020-05-16 00:23:52
Creation time: 2020-05-14 16:03:50
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ID Name Designator Footprint Quantity
1 E3 MW1 DRV8825-MODULE 1
2 C100U CMW1 CAP-AL-B 1
3 JA4 JW JST XH-04 1
4 ULN2003ADR TA1,TA2 SOIC-16_L9.9-W3.9-P1.27-LS6.0-BL 2
5 10uF C4,C2 CAP-SMD_L3.2-W1.6-R-RD 2
6 J5 JZ,JC,JV JST_XH_5 3
7 J2 JLIMZV,JLIMC,JLIMW1,JLEDR,JLEDL,JFOCUS JST-XH-2 6
8 K5 HICP HDR1X5 1
9 K1 TPGND HDR1 1
10 R100 RM,RW AXIAL-0.4 2
11 J4 JPANEL JST XH-04 1
12 E7 BUZZER BUZZER 1
13 PIC24F16KL402-I/SS MCU SSOP-28_L10.2-W5.3-P0.65-LS7.8-BL 1
14 2N7002 Q6,Q7 SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR 2
15 J14F RASPI HDR-7X2/2.54 1
16 100nF C1,C3 C0603 2
17 J6 JBUS JST-XH-6 1
18 10K RN2,RN1,RN3 RES-ARRAY-SMD_0603-8P-L3.2-W1.6-BL 3
19 B5819W_C8598 SD SOD-123_L2.8-W1.8-LS3.7-RD 1

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