Editor Version ×
Standard

1.Easy to use and quick to get started

2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

Ongoing

STD Rightbot Task

License: Public Domain

Mode: Editors' pick

Cloned from rightbot task

  • 534
  • 0
  • 0
Update time: 2021-11-17 20:18:54
Creation time: 2021-02-03 21:20:19
Description

Solution and Design approach:

I usually have used Autodesk Eagle but as my college licence is expired and the free version only supports two layered PCB designs, So I have used EasyEDA for now.

Design Approach:

  1. Designing the buck converter, selection of the topology and explaining in detail the selection of all your components. You can use an IC for the same too.
    1. For voltage regulators for motor drivers, I have decided to remove it and control the output voltage through MOSFET via constantly reading the current battery voltage. This removes the very big part of the circuit and reduces the extra thermal and electrical losses. This solution felt very practical for manufacturing.
    2. For buck-converter of other circuits, I have chosen a Smart Gate driver IC for by Texas Instruments. This IC has a Integrated LM5008A buck regulator for powering the extra circuit. This also removed the extra components required for buck converters, providing compact design and reduction in manufacturing cost.
  2. Design the Motor Driver Circuit for making things easy. You can choose any good motor driver IC from Texas Instruments.
    1. I have chosen Smart Gate Driver IC DRV8350R https://www.ti.com/document-viewer/DRV8350R/datasheet to control the mosfet which comes with plenty of integrated and protection features.
    2. I have chosen CSD19536KTT MOSFET https://www.ti.com/document-viewer/CSD19536KTT/datasheet. This MOSFET is capable of handling 272A of current(Theoretically). And can survive 400A of peak current at 100V of supply.
    3. High current carrying copper paths are kept exposed so it can be filled with extra soldering material to make them thicker.  
  3. As mentioned, your PCB should be detailed with all silkscreen. The maximum number of layers you can go to is 6, also explain the stackup and why you choose the same.
    1. I have chosen 4 layers of stackup with Signal, Power, Ground, Signal layers because this PCB can be easily designed with this stack up as I have initially removed unnecessary components by selecting some proper components.  
  4. Your communication channel should have proper protection and filters else your communication channel will induce noise.
    1. I have added required decoupling capacitors at STM32.
    2. I have added ferrite beads where necessary.
    3. Track length analysis is done at communication channels and have tuned the channels where needed.
    4. Extra IC is included to avoid damage through the micro-USB port.
  5. You may or may not choose to have a heatsink.
    1. The components which I have chosen can handle the current without heating a lot.
    2. Still, I have included mounting holes for the heatsink just in case the MOSFETs get heated in practical.
    3. In case, we choose to use heat sink some modifications to be done during soldering of Motor terminal pins. Those terminal pins should be soldered from bottom layer of PCB 
  6. Battery is not mounted on the board so you need to give a proper connection for the same.
    1. I have used a standard XT-60-M connector for the same. 
  7. Things to take care of are the EMI/EMC effect, power analog digital grounding, component placement. 
    1. Included the Multiple GND vias to reduce the return current path.
    2. I have tried keeping the MOSFET, Inductor and Capacitor path as small as possible to reduce the EMI/EMC generation.
    3. As we are not doing any sensitive analog process so I skipped the separation of analog-digital grounding. Anyways, It works perfect without doing it for sure (https://youtu.be/vALt6Sd9vlY)
    4. I have tried to keep sections far from each other and tried to keep components as close as possible within these sections to reduce interference between two sections.
Design Drawing
schematic diagram
1 /
PCB
1 /
The preview image was not generated, please save it again in the editor.
ID Name Designator Footprint Quantity
1 IPB110P06LM Q5 PG-TO263-3_L10.3-W9.4-P2.54-BR 1
2 Z-SUBDPBF5071092 DSUB1 DB15-TH_Z-SUBDPBF5071092 1
3 HPCR0402F36K0K9 U3 R0402 1
4 1M R36 R0603 1
5 4.7uF C55 C0603 1
6 7693 U4,U5,U6 CONN-TH_4P-P5.00-S7.00_L8.0-W8.0 3
7 1uF C3,C22,C26 C0805 3
8 2.2uF C4,C6,C16,C21,C35,C36 C0805 6
9 0.47uF C5 C0805 1
10 1nF C8,C14,C15,C19,C20 C0805 5
11 3.9nF C11,C12,C17,C9 C0805 4
12 47nF C23 C0805 1
13 0.1uF C24 C0805 1
14 10uF C25 C0805 1
15 820uF C7 CAP-SMD_BD16.0-L17.0-W17.0-FD 1
16 JTAG-PROG-CONN JTAG1 JTAG-10PIN-1.27MM-SMT 1
17 XT60-M U7 XT60-P 1
18 3.9nF C10,C13,C18 C1206 3
19 LM1117MP-3.3/TR U1 SOT-223-3_L6.5-W3.4-P2.30-LS7.0-BR 1
20 ZH1.5-6P SMD CN3 CONN-SMD_ZH1.5-6P_SMD 1
21 LM1117MP-5.0/TR U9 SOT-223-3_L6.5-W3.4-P2.30-LS7.0-BR 1
22 ZH1.5-4P SMD CN4,CN1 CONN-SMD_ZH1.5-4P_SMD 2
23 STM32F407IET6 U11 STM32F407IET6 1
24 micro USBFemale USB1 MICRO-USB-SMD_5P-P0.65-H-F_C10418 1
25 100nF C39,C40,C41,C42,C44,C45,C46,C43,C47,C48,C49,C50,C51,C52,C53 C0603 15
26 33uH L1,L2 IND-SMD_L4.0-W4.0 2
27 12pF C37,C38 C0603 2
28 0.91 R4 R0603 1
29 20K R5,R3 R0603 2
30 0 R6,R18,R42,R26,R27 R0603 5
31 1.5 R7,R8,R9,R10,R12,R11 R0603 6
32 10K R15,R16,R40,R39 R0603 4
33 100 R17,R21,R24,R28,R29,R30 R0603 6
34 18K R19,R22 R0603 2
35 75K R20,R23 R0603 2
36 3K3 R31,R32,R33 R0603 3
37 2K2 R34,R35 R0603 2
38 2.2K R41 R0603 1
39 220 R37 R0603 1
40 BPH403025W4-470T L3 BEAD-SMD_L4.0-W3.1 1
41 10nF C1 C0603 1
42 ST-1188U SW2 SW-SMD_ST-1188U 1
43 MMSZ5239BS-PEC D1 SOD-323_L1.8-W1.3-LS2.5-RD 1
44 TA-3524A-A1-W SW3,SW1 CONN-TH_TA-3524A-A2 2
45 102K R45 R0603 1
46 133K R1 R0603 1
47 3nF C2 C0603 1
48 16MHz X1 OSC-SMD_4P-L3.2-W2.5-BL 1
49 249K R25 R0603 1
50 49.9K R38 R0603 1
51 XL-0805QBC LED1,LED2,LED3 LED0805-RD 3
52 10uF C31,C32,C33,C34 C0603 4
53 USBLC6-2SC6 U2 USBLC6-2SC6 1
54 SMD0603P050TF F1 F0603 1
55 4.02K R2 R0603 1
56 3.3uF C27,C30 C1210 2
57 0.1uF C28,C29 C1210 2
58 DFLS1200-7 D2,D5 POWERDI-123_L2.8-W1.8-LS3.7-RD 2
59 DRV8350RHRGZR IC1 QFN50P700X700X100-49N 1
60 CSD19536KTT Q1,Q2,Q3,Q4,Q6,Q7 KTT0002A_N 6
61 ZRE RB520S-30 D4 SOD-523_L1.2-W0.8-LS1.6-RD 1

Unfold

Project Attachments
Empty
Project Members
Related Projects
Change a batch
Loading...
Add to album ×

Loading...

reminder ×

Do you need to add this project to the album?

服务时间

周一至周五 9:00~18:00
  • 0755 - 2382 4495
  • 153 6159 2675

服务时间

周一至周五 9:00~18:00
  • 立创EDA微信号

    easyeda

  • QQ交流群

    664186054

  • 立创EDA公众号

    lceda-cn