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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2021-04-09 20:40:34
Creation time: 2017-03-02 15:59:45
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ID Name Designator Footprint Quantity
1 AC220_IN X1 WJ2EDGVC-5.08-2P 1
2 LOAD220 X2 WJ2EDGVC-5.08-2P 1
3 AC_DC_OUT X3 WJ2EDGVC-5.08-2P 1
4 DC_IN X4 WJ2EDGVC-5.08-2P 1
5 DD1 DIGISPARK DIGISPARK 1
6 0.1u C1 RAD-0.1 1
7 36 R1 AXIAL-0.6 1
8 MOC3021 DD2 DIP-6_300MIL 1
9 BT137 Q1 TO-220 1
10 510 R2 AXIAL-0.3 1
11 PC817A DD3 DIP-4 1
12 MB10S DD4 BRIDGE-MBS 1
13 43k R3,R4 AXIAL-0.3 2
14 10k R5,R11 R1206 2
15 300 R6,R10 R1206 2
16 KS-12065D03YA BUZ BZ2-7.6-D12.0XH6.5MM 1
17 100 R7 R1206 1
18 SWITCH-6x6x5_TH SW1 TACT-BUTTON-6X6X5 1
19 5k R8 WJ2EDGVC-5.08-3P 1
20 sensor X5 WJ2EDGVC-5.08-2P 1
21 1k R9 R1206 1
22 red HL1 LED-3MM/2.54 1
23 btn_OUT X6 WJ2EDGVC-5.08-2P 1

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