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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2021-09-27 05:29:42
Creation time: 2017-11-09 00:04:14
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Manufacturer BOM_Manufacturer Part BOM_Supplier Part
1 100nF C1,C3,C5 1210 3 LCSC FH 1210B104K251NT C52020
2 470pF C2 1206 1 LCSC FH 1206CG471J500NT C1917
3 SMBJ22A D1 SMB(DO-214AA) 1 LCSC RUILON SMBJ22A C10214
4 DS1037-09FNAKT74-0CC J1 DSUB9-1 1 LCSC CONNFLY DS1037-09FNAKT74-0CC C75749
5 150KΩ R1 2010 1 LCSC UniOhm 2010W2J0154T4S C20360
6 4.7KΩ R2 2010 1 LCSC UniOhm 2010W2J0472T4S C20431
7 120KΩ R3 2010 1 LCSC UniOhm 2010W2J0124T4S C20354
8 22KΩ R4 2010 1 LCSC UniOhm 2010W2J0223T4S C20387
9 1.2KΩ R5 2010 1 LCSC UniOhm 2010W2J0122T4S C18479
10 270KΩ R6 2010 1 LCSC UniOhm 2010W2J0274T4S C20392
11 3.9KΩ R7 2010 1 LCSC UniOhm 2010W2J0392T4S C19630
12 TL082IDR U1 SOIC-8_150MIL 1 LCSC TI TL082IDR C6966
13 4N25SR2M U3 SOIC-6 1 LCSC FAIRCHILD 4N25SR2M C44165

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