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2.The process supports design scales of 300 devices or 1000 pads

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STD TPA3116v1

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Mode: Editors' pick

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Update time: 2024-01-16 07:18:24
Creation time: 2019-01-06 13:12:20
Description
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ID Name Designator Footprint Quantity
1 2.2u C1,C6 0805 2
2 1u C2,C12,C13,C14,C25,C31,C32 0805 7
3 680nF C3,C5,C7,C19 CAP-CBB-7.0*4.0 4
4 1nF C4,C8,C9,C27 0805 4
5 10nF C10,C20,C22,C26 0805 4
6 330p C11,C21,C28,C29,C30 0805 5
7 220nF C15,C16,C17,C18 0805 4
8 1000uF C23,C24 CAP-D12.5XF5.0 2
9 SPEAKER OUT R J1 TERMINAL_BLOCK_2P_5 1
10 SPEAKER OUT L J2 TERMINAL_BLOCK_2P_5 1
11 Power J3,J4 TERMINAL_BLOCK_2P_5 2
12 10uH L1,L2,L3,L4 12.5*12.5*7.5 4
13 10uH L5,L6,L7,L8 L-8.5*8.3MM 4
14 10uH L9 IND-SMD_L7.1-W6.8 1
15 5264-04A P1 5264-04A 1 //image.lceda.cn/szlcsc/C40159.jpg
16 10k R1,R21 0805 2
17 100k R2,R6,R7 0805 3
18 3R3 R3,R4,R5,R10,R11,R12,R13,R14 0805 8
19 dnp R8 0805 1
20 5k6 R9 0805 1
21 TPA3116D2DADR U3 HTSSOP-32 1

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