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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

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Update time: 2023-03-23 20:13:12
Creation time: 2018-08-09 09:58:01
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ID Name Designator Footprint Quantity Mounted
1 NE555P U1 DIP-8 1 Yes
2 100n C1,C2 RAD-0.2 2 Yes
3 1k R1 AXIAL-0.4 1 Yes
4 470 R4 AXIAL-0.4 1 Yes
5 1.5k R2 AXIAL-0.4 1 Yes
6 2N4403 Q1 TO-92(TO-92-3) 1 Yes
7 100k R100 AXIAL-0.4 1 Yes
8 33 R3 AXIAL-0.4 1 Yes
9 150 R150 AXIAL-0.4 1 Yes
10 390 R5,R6 AXIAL-0.4 2 Yes
11 IRF740PBF Q2 TO-220(TO-220-3) 1 Yes
12 1m L1 AXIAL-0.5 1 Yes
13 1N4448 D1,D2 DO-35 2 Yes
14 1u C3,C6 CAP-D3.0XF1.5 2 Yes
15 LM358P U2 DIP-8 1 Yes
16 1m R16 AXIAL-0.4 1 Yes
17 68k R7,R11 AXIAL-0.4 2 Yes
18 47k R70,R8 AXIAL-0.4 2 Yes
19 10u C4 CAP-D4.0XF1.5 1 Yes
20 10k R9 RES-ADJ_3386P 1 Yes
21 1n C5 RAD-0.2 1 Yes
22 120k R10 AXIAL-0.4 1 Yes
23 470k R12 AXIAL-0.4 1 Yes
24 BC547B Tube Q3 TO-92(TO-92-3) 1 Yes
25 Header-Female-2.54_1x2 P1 HDR-1X2/2.54 1 Yes
26 2200uf C7 CAP-D12.5XF5.0 1 Yes

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