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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2020-07-11 16:21:26
Creation time: 2016-09-27 16:27:19
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ID Name Designator Footprint Quantity
1 Attyni13A U1 DIP08 1
2 IRF4905 VT6,VT5,VT4 TO-220 3
3 20 R8,R9,R10 DO-35 3
4 2N5551 VT2 TO-92 1
5 2N5401 VT3 TO-92 1
6 1k R7,R3 DO-35 2
7 2N5551 VT1 TO-92 1
8 10k R5,R6,R4,R2 DO-35 4
9 SPST_OFF S1 TACTILE-PTH 1
10 0.1 C4,C2 RAD-197 2
11 47 C3,C1 RAD-197 2
12 78L05 U2 TO-92 1
13 30K R1 DO-35 1
14 1N4448 D1,D2,D3,D4,D5 DO-35 5
15 SIP2 P1,P2,P3,P4 HDR1X2 4
16 NE555N U1 DIP8 1
17 MOC3021M U2 DIP-6_300MIL 1
18 1N4733A D1 DO-41 1
19 1N4007 D2,D3,D4,D5 DO-41 4
20 0.01uFx250V C1,C4 RAD-0.1 2
21 470uF C2,C5 CAP-D10.0XF5.0 2
22 BT136 Q1 TO-220 1
23 Header-Female-2.54_1x2 P1 HDR-1X2/2.54 1
24 Vent P2 HDR-1X2/2.54 1
25 AC 220V P3 HDR-1X2/2.54 1
26 1mo R1 RES-ADJ_SF065 6.4x7.3 1
27 2k R2 AXIAL-0.3 1
28 250 R3 AXIAL-0.3 1
29 1uF C3 C0805_MURATA_GRM 1
30 330 R4,R5 AXIAL-0.3 2
31 39 R6,R8 AXIAL-0.3 2
32 820k R7 AXIAL-0.3 1

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