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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD NEW COOLER PROJECT
Mode: Editors' pick
PCB_2020-01-17 12:03:50
Open in EditorPCB_2020-01-18 13:24:28
Open in EditorNEW COOLER DEVELOPMENT
Open in EditorID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | BC547B Tube | Q2 | TO-92_3PIN-L4.95-W3.94-PITCH2.54-L | 1 |
2 | SRD-03VDC-SL-C | K1 | RELAY-SL-SRD | 1 |
3 | Header-Male-2.54_1x4 | H1 | DIP-1X4P-2.54MM-M | 1 |
4 | BTA41-600BQ | Q3 | TO-3P | 1 |
5 | 47k | R1,R2 | AXIAL-0.8 | 2 |
6 | 100 ohm | R5 | AXIAL-0.8 | 1 |
7 | Header-Male-2.54_1x3 | P2 | HDR-3X1/2.54 | 1 |
8 | 4N35 | U2 | DIP-6 | 1 |
9 | 1k | R9 | AXIAL-0.8 | 1 |
10 | CON_TERMINAL_BLOCK_02 | J1,J2,J3 | TERMINAL_BLOCK_2P_5 | 3 |
11 | MB10M(0.8A) | D1 | MB-1-4.83X4.10 | 1 |
12 | 220 ohm | R4,R6 | 1206 | 2 |
13 | 1k | R8 | 1206 | 1 |
14 | 10k | R7 | 1206 | 1 |
15 | 100nF | C1 | CAP-TH_D1.20-L20.50-W13.50-PITCH17.50 | 1 |
16 | 1k | R3 | 1812 | 1 |
17 | MOC3021 | U1 | DIP-6 | 1 |
18 | LED-3MM | LED1 | LED-3MM/2.54 | 1 |
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