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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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STD spg project
Mode: Editors' pick
spg project pcb board
Open in Editor#2 pcb
Open in Editor#1 PCB
Open in Editorboard
Open in EditorID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | C1 | C1 | CAPACITOR-SMD | 1 |
2 | RESISTOR-SMD-0805 | R3,R5 | SMD-0805 | 2 |
3 | 39pF | C6,C7 | CAP-TH_L4.8-W3.2-P5.08-D0.5 | 2 |
4 | 47uF | C5,C2,C3,C4 | 1210 | 4 |
5 | a | CN2,CN1 | HEADER-POGO-5.08_1X4 | 2 |
6 | RESISTOR0805-RES SMD | R4,R6,R2 | 0805 | 3 |
7 | R1 | R1 | 0805 | 1 |
8 | TPS54360DDAR | U1 | HSOP-8 | 1 |
9 | 8.2uH | L1 | FIXED INDUCTORS WE-HCC HCUR CUBE1090 | 1 |
10 | MR856G | D1 | DO-201AD | 1 |
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