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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD I2C Mux for MLP

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Update time: 2019-09-04 00:39:02
Creation time: 2019-08-04 03:29:59
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Supplier Part BOM_Manufacturer BOM_Manufacturer Part
1 100nF C2 1206 1 LCSC C338139 Huaxin S&T 1206B104K251CT
2 MLP H1 210S-1X4P 1 LCSC C124378 Ckmtw 210S-1*4P L=11.6MMGold-plated black
3 4.7K R2,R3,R1,R7,R6,R5,R4 1206 7 LCSC C26043 UniOhm 1206W4J0472T5E
4 TCA9548APWR U1 TSSOP-24 1 LCSC C130026 TI TCA9548APWR
5 ME2188C50M5G U2 SOT-23-5 1 LCSC C236768 Nanjing Micro One Elec ME2188C50M5G
6 10uF C3 1206 1 LCSC C50691 SAMSUNG CL31F106ZOHNNNE
7 Murata L1 1212 1 LCSC C110302 Murata Electronics LQH3NPN220MJRL
8 47uF C4,C5 1206 2 LCSC C96123 SAMSUNG CL31A476MPHNNNE
9 Probe 2 J2 HDR-TH_6PIN-V-ROW2-COL3-MALE-PITCH2.54 1 LCSC C65114 BOOMELE Header-Male-2.54_2x3
10 Probe 1 J1 HDR-TH_6PIN-V-ROW2-COL3-MALE-PITCH2.54 1 LCSC C65114 BOOMELE Header-Male-2.54_2x3

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