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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD JBC_SmThng

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Update time: 2022-01-20 18:31:56
Creation time: 2019-02-20 18:56:43
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ID Name Designator Footprint Quantity
1 BUK7M42 Q1,Q2 LFPAK33 2
2 opt. R8,R9 AXIAL-0.4 2
3 5k R10,R11 AXIAL-0.4 2
4 1M R12 AXIAL-0.4 1
5 100u C6,C7 CAP-D6.3XF2.5 2
6 1u C8,C9 CAP-D6.3XF2.5 2
7 C1S 2A F1 1206 1
8 BAV199 D5 SOT-23(SOT-23-3) 1
9 ATMEGA328PB-AU U1 TQFP-32_7X7X08P 1
10 LCD P2 HDR-2.54-6P 1
11 Rotary P3 HDR-2.54-6P 1
12 ICSP P1 HDR-3X2/2.54 1
13 2 Pin Header JP1 HDR1X2 1
14 NCP1117ST25T3G U2 SOT-223 1
15 1N4007 D1,D2,D3,D4 DO-41 4
16 Terminals/WJ2EDGV-5.08-8P P4 WJ2EDGV-5.08-8P 1
17 Single J1,J2 PKG-JUMPER-SMD-1X1 2
18 Dual J3 PKG-JUMPER-SMD-1X1 1
19 1n C1,C10 0805 2
20 1u C2,C3 0805 2
21 100n C4,C5,C12,C13,C14 0805 5
22 1.2n C11 0805 1
23 AT_mega328P-AU U6 TQFP32 1
24 TLP3906 U3 SMD-4(4.55X3.7) 1
25 MAX400MJA IC1 DIL08 1
26 -5V TP1 TESTPOINT_2MM 1
27 +5V TP2 TESTPOINT_2MM 1
28 ADC TP4 TESTPOINT_2MM 1
29 HEAT TP5 TESTPOINT_2MM 1
30 GND TP3,TP7,TP8 TESTPOINT_2MM 3
31 +8V TP9 TESTPOINT_2MM 1
32 -8V TP10 TESTPOINT_2MM 1
33 79L05Z U4 TO92 1
34 OP07CDR U5 SOIC-8_150MIL 1
35 300R R1 0805 1
36 10k R2,R5,R7,R13,R14,R15,R16,R17,R18 0805 9
37 100k R3 0805 1
38 250R R4 0805 1
39 1M R6 0805 1

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