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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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License: Public Domain

Mode: Editors' pick

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Update time: 2019-10-25 10:13:03
Creation time: 2019-10-25 04:42:32
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Manufacturer BOM_Manufacturer Part BOM_Supplier Part
1 SS49E U1 TO-92_3PIN-L4.00-W1.52-PITCH1.27-L 1 LCSC Honeywell SS49E C85697
2 22K R4 0603 1 LCSC YAGEO AC0603FR-0722KL C144680
3 STM32F303RET6 U3 STM-LQFP64 1 LCSC STMicroelectronics STM32F303RET6 C183214
4 150K R2,R1 0603 2 LCSC ResistorToday AECR0603F150KK9 C328337
5 HLK-PM03 U5 PWRM-TH_HLK-PM01 1 LCSC HI-LINK HLK-PM03 C209904
6 220uF C2 CAP-6.3*5.5 1 LCSC CapXon ZV221M6R3E055R C84689
7 X2564WV-06-N0SN CN1 CONN-TH_6PIN-V-PITCH2.50-R_X2564WV-06-N0SN 1 LCSC XKB Enterprise X2564WV-06-N0SN C397420
8 464K R3 0603 1 LCSC YAGEO AC0603FR-07464KL C227912
9 OP07CSZ-REEL7 U2 SOIC-8_150MIL 1 LCSC ADI OP07CSZ-REEL7 C143866

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