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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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STD DAC_1_U3
Mode: Editors' pick
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Update time：
2019-05-23 12:46:51
Creation time：
2019-05-06 08:51:40
Description
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | 0.1u | C3,C1,C43,C2,C44,C4.3X,C18,C19,C20,C4 | 0805 | 10 |
| 2 | MCP3553-ESN | U2 | SOIC8 | 1 |
| 3 | MCP4725A0T-E/CH | U3,U1 | SOT-23-6 | 2 |
| 4 | 100 | R1,R22,R18 | 0805 | 3 |
| 5 | 1M | R8,R9,R5,R7,R4,R16,R20,R12 | 0805 | 8 |
| 6 | 1k | R6,R15 | 0805 | 2 |
| 7 | LMP7715MF/NOPB | U7 | SOT-23-5 | 1 |
| 8 | LMP7721MA/NOPB | U6 | SOIC-8_150MIL | 1 |
| 9 | ADG804YRMZ-REEL7 | U5 | MSOP10-0.5 | 1 |
| 10 | 100k | R13,R23 | 0805 | 2 |
| 11 | 1u | C13,C17 | 0805 | 2 |
| 12 | 22p | C16 | 0805 | 1 |
| 13 | 0R | R19,R17 | 0805 | 2 |
| 14 | 10k | R14 | 0805 | 1 |
| 15 | gas sensor | H1 | DIP-1X4P-2.54MM-M | 1 |
| 16 | BME | H2 | DIP-1X4P-2.54MM-M | 1 |
| 17 | RTC | H3 | DIP-1X4P-2.54MM-M | 1 |
| 18 | WIND/ LIGHT | H4 | DIP-1X4P-2.54MM-M | 1 |
| 19 | POWER INPUT | P3 | HDR-1X2/2.54 | 1 |
| 20 | RASPBERRY | P1 | HDR-20X2/2.54 | 1 |
| 21 | 0.1u | C5,C6,C24 | RAD-0.1 | 3 |
| 22 | REF3033AIDBZR | U8 | SOT-23(SOT-23-3) | 1 |
| 23 | 10u | C25 | RAD-0.1 | 1 |
| 24 | 1u | C9,C10 | RAD-0.1 | 2 |
| 25 | LM2621MMX/NOPB | U9 | VSSOP-8 | 1 |
| 26 | LMC6042AIMX | U4 | SOIC8 | 1 |
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