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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2020-07-02 23:26:42
Creation time: 2019-10-27 14:30:11
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ID Name Designator Footprint Quantity
1 10R R10,R1,R4,R5,R8,R9,R14 R-7,5 7
2 SG3525 IC1 DIL-16 1
3 4700uF C1,C4 E7,5-16 2
4 IRF1404 Q1,Q2,Q3,Q4,Q5,Q6,Q7,Q8 TO220BV 8
5 10uF C2 CAP-2,5 1
6 1K R11,R2,R13 R-7,5 3
7 104 C3 PPCAP_22P5MM 1
8 50K VR1 VR-5 1
9 10R4 R6 R-7,5 1
10 2K R7,R12 R-7,5 2
11 110K R3 R-7,5 1
12 Out1 TER2 DOMINO-1 1
13 T1 TER3 DOMINO-1 1
14 In1 TER4 DOMINO-1 1
15 S8550 Q9,Q10,Q11 TO92 3
16 S8050 Q12 TO92 1
17 SW TER5 DOMINO-3 1
18 1N4007 D1,D2 1N4007 2
19 100uF C5 CAP-2,5 1
20 10K R15 R-7,5 1
21 47K R16 R-7,5 1
22 LED-5 LED1,LED2 LED5MM 2
23 44K7 R17 R-7,5 1
24 4K7 R18 R-7,5 1
25 RELAY-5 RL1 RELAY-5 1

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