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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2018-12-28 10:57:06
Creation time: 2018-12-27 15:13:21
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ID Name Designator Footprint Quantity
1 MCP601T-I/OT U1 SOT-23-5 1
2 100nF C1,C11,C14,C15 0805 4
3 10uH L3 0805 1
4 ME6211C33M5G-N LDO1 SOT-23-5 1
5 10uF C4,C9,C10,C12,C13 0805 5
6 22uH L2 L3015 1
7 47uF C8 1206 1
8 200KΩ R1,R3,R4 0805 3
9 100pF C3 0805 1
10 2KΩ R2,R12 0805 2
11 10nF C5,C6,C7 0805 3
12 1MΩ R5,R6 0805 2
13 MT3608 U2 SOT-23-6 1
14 100KΩ R7,R13 0805 2
15 11KΩ R8 0805 1
16 SS14 D1 SMA(DO-214AC) 1
17 TC4420EOA U3 SOIC-8_150MIL 1
18 33Ω R9,R10,R11 1206 3
19 ME6211C50M5G LDO2 SOT-23-5 1
20 470uF C16 CASE-D_7343 1
21 hc05_bt U4 BT34P-SMD-1.5-26.9X13.0X2.2MM 1
22 6x6x6Plastic head KEY1 KEY-6.0*6.0 1
23 CD4148WSP D3 0805 1
24 100uF C2 CASE-B_3528 1

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