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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

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STD ADC-2

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Update time: 2020-07-05 11:05:17
Creation time: 2020-05-16 01:00:58
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ID Name Designator Footprint Quantity
1 ULN2804A U7 DIP-18_L23.0-W6.5-P2.54-LS7.6-BL 1
2 74LS273 U29 DIP-24_L31.7-W6.6-P1.27-LS7.62-BL 1
3 TLC0820ACN U5 DIP20 1
4 100k R72,R73 RES-ADJ_3386P 2
5 1K R80,R81,R82,R93,R95,R96,R97 AXIAL-0.3 7
6 2K R86,R87,R88,R89,R90,R91,R92 AXIAL-0.3 7
7 4K R76,R77,R78,R79,R83,R84 AXIAL-0.3 6
8 8K R85,R94,R98,R99,R100 AXIAL-0.3 5
9 16K R101,R102,R103,R104 AXIAL-0.3 4
10 32K R105,R107,R108 AXIAL-0.3 3
11 64K R106,R110 AXIAL-0.3 2
12 128K R109 AXIAL-0.3 1
13 LM6142BIN U1 DIP8 1

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