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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2022-12-12 10:05:25
Creation time: 2017-03-14 21:04:54
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ID Name Designator Footprint Quantity BOM_Manufacturer Part
1 CR2032-BS-2-1 B1 BATTERY-1 1 CR2032-BS-2-1
2 22pF C1,C2 0805 2 0805CG220J500NT
3 6.8pF C3,C4 0805 2 0805CG6R8C500NT
4 10nF C5,C6,C7 0805 3 0805CG220J500NT
5 100nF C8,C9 0805 2 0805CG220J500NT
6 SWD P1 HDR-4X1/2.54 1 Header-Male-2.54_1x4
7 SOURCE P2 WJ300V-5.00-2P 1 WJ300V-5.00-2P
8 POWER P3 HDR-2X1/2.54 1 Header-Male-2.54_1x2
9 10KΩ R1,R2 0805 2 0805W8F1002T5E
10 1K R3 0805 1 0805W8F1002T5E
11 100K R4 0805 1 0805W8F1002T5E
12 RESET SW1 SWITCH-6X6X5_TH 1 SWITCH-6x6x5_TH
13 LINK SW2 SWITCH-6X6X5_TH 1 SWITCH-6x6x5_TH
14 32.768 TXAL1 TXAL-3*8 1 X308032768KGB2SC
15 NRF24L01 U3 NRF24L01 SMD ANTENNA 1 NRF24L01
16 STM32F100C8T6B U4 LQFP-48_7X7X05P 1 STM32F100C8T6B
17 8MHZ X1 OSC-49S-1 1 X49SD8MSD2SC

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