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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2020-07-19 13:21:04
Creation time: 2020-07-19 13:20:03
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ID Name Designator Footprint Quantity
1 1m L1 L_AXIAL-0.6 1
2 1k R1,R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R12,R13,R14,R15,R16,R17,R18,R19,R20,R21,R22,R23,R24,R25,R26,R27,R28 R_AXIAL-0.3 28
3 NE555P U2 DIP-8_L9.8-W6.6-P2.54-LS7.6-BL 1
4 DS3231 M1 DS3231 1
5 ARDUINO_NANO U1 ARDUINO_NANO 1
6 TERMINAL_HDR-6X1/2.54 P5,P6 HDR-6X1/2.54 2
7 bc547 Q3,Q2,Q4,Q5,Q6,Q7,Q8,Q9,Q10,Q11,Q12,Q13,Q14 BC547 13
8 DISP_VFD_IV-22 DISP1,DISP2,DISP3,DISP4 DISP_IN-12_SOCKET 4
9 IRF740 Q1 TO-220-3_L10.0-W4.5-P2.54-L 1
10 Header-Female-2.54_1x8 P1 HDR-8X1/2.54 1
11 Header-Male-2.54_1x8 P2 HDR-8X1/2.54 1
12 1u C1,C2 RAD-0.1 2
13 UF4004 D1 DO-41_BD2.4-L4.7-P8.70-D0.9-RD 1

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