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2.The process supports design scales of 300 devices or 1000 pads

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STD module_poliva

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Update time: 2021-07-16 12:30:50
Creation time: 2018-12-01 14:14:40
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ID Name Designator Footprint Quantity
1 none AC-DC5V700MA AC-DC5V700MA 1
2 10nF C1,C2,C3,C4 RAD-0.1 4
3 1N4007 D3,D4 DO-41 2
4 5.08-2P P1,P2,P4,P6,P7,P8,P9,P10,P11,P12,P13,P14,P15,P20 WJ2EDGVC-5.08-2P 14
5 DS3231 P3 HDR-6X1/2.54 1
6 UART P5 HDR-4X1/2.54 1
7 DALLAS P16 HDR-3X1/2.54 1
8 I2C P17,P18,P19 HDR-3X1/2.54 3
9 IRF9Z24 Q1,Q8 TO-220(TO-220-3) 2
10 BT138 Q2,Q3,Q4,Q5 TO-220F(TO-220IS) 4
11 2N3904 Q6,Q9 TO-92(TO-92-3) 2
12 IRF7314TRPBF Q7 SOIC-8_150MIL 1
13 39 R1,R5,R8,R11 AXIAL-0.3 4
14 330 R2,R3,R4,R6,R7,R9,R10,R12 AXIAL-0.3 8
15 10K R13,R14,R18,R25 AXIAL-0.3 4
16 10k R15,R16,R17,R22 AXIAL-0.3 4
17 1K R19,R31 AXIAL-0.3 2
18 20 R20,R32 AXIAL-0.3 2
19 1k R21 AXIAL-0.3 1
20 10k R23,R24,R26 0805 3
21 150 R27,R28,R29,R30 AXIAL-0.3 4
22 NodeMCU_V3 copy U1 NODEMCU_V3_LOLIN 1
23 PCF8574PN U3 DIP16 1
24 MOC3063M U4,U5,U6,U7 DIP-6 4
25 CD4051BE U8 DIP-16_16PIN-LS7.62-L19.69-W6.6-H5.08-PITCH2.54 1

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