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Standard

1.Easy to use and quick to get started

2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

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STD LinkIt Smart 7688_thermal

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Mode: Editors' pick

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Update time: 2022-02-15 11:20:14
Creation time: 2018-10-31 07:49:21
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ID Name Designator Footprint Quantity
1 1u/06 C2,C3,C4,C5,C6,C8,C12,C13,C14,C15,C16,C17,C18 C0603 13
2 10u/16/1206 C7 C1206 1
3 0.1u/06 C9 C0603 1
4 22N/06 C10,C11 C0603 2
5 10U/16V/1206 C28 C1206 1
6 10u/06 C29 C0603 1
7 2501S-2P CN1 DIP-1X2P-2.54MM-CK 1
8 Header-Male-2.54_2x19 P1 HDR-20X2/2.54 1
9 0R/06 R1,R2,R3,R4 R0603 4
10 220R/06 R5,R6,R7,R8 R0603 4
11 TXB0104DR U1,U3 SOIC14N 2
12 TXB0104PWR U4 TSSOP-14 1
13 RT9193-28GB U5 SOT-23-5 1
14 RT9193-33GB U6 SOT-23-5 1
15 APL1117-3.3 U7 SOT-223 1
16 LinkIt_Smart_7688 U8 LINKIT_SMART_7688 1

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