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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2019-03-11 08:37:44
Creation time: 2017-07-02 12:15:04
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ID Name Designator Footprint Quantity
1 XR2206 U1 DIL16 1
2 2T3531 T2 TO39 1
3 2N5068 T3,T4 TO3-2 2
4 100 R9 AXIAL-0.3 1
5 560 R10 AXIAL-0.3 1
6 2.2k R11 AXIAL-0.3 1
7 8.2k R7 AXIAL-0.3 1
8 2.7k R8 AXIAL-0.3 1
9 5.1k R4,R1,R2 AXIAL-0.3 3
10 33k R5 AXIAL-0.3 1
11 3.3k R3 AXIAL-0.3 1
12 200 R6 AXIAL-0.3 1
13 10u C1 CAP-D3.0XF1.5 1
14 1000u C4 CAP-D3.0XF1.5 1
15 1u C3,C2 RAD-0.1 2
16 Header-Female-2.54_1x2 P4 HDR-1X2/2.54 1
17 2N4125 T1 TO92-INLINE 1
18 220k P2 RES-ADJ_3296W 1
19 4.7k P3 RES-ADJ_3296W 1
20 100k P1 RES-ADJ_3296W 1
21 6.8n C5,C6,C7 RAD-0.1 3

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