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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD 1wire

License: Public Domain

Mode: Editors' pick

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Update time: 2024-02-16 16:27:40
Creation time: 2019-04-17 22:36:14
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ID Name Designator Footprint Quantity Manufacturer Part Manufacturer Supplier JLCPCB Part Class spiceSymbolName
1 100uF C1 CASE-A_3216 1 T520A107M006ATE045 KEMET(基美) LCSC C212680 Extended Part T520A107M006ATE045
2 100nF C2 C0402 1 CL05B104KB54PNC SAMSUNG(三星) LCSC C307331 Basic Part CL05B104KB54PNC
3 CUS10S30,H3F D1 SOD-323_L1.8-W1.3-LS2.5-RD 1 CUS10S30,H3F TOSHIBA(东芝) LCSC C146335 Extended Part CUS10S30,H3F
4 10kΩ R1 R0402 1 0402WGF1002TCE UNI-ROYAL(厚声) LCSC C25744 Basic Part 0402WGF1002TCE
5 ATTINY85-20SUR U1 SOIC-8_L5.3-W5.3-P1.27-LS8.0-BL 1 ATTINY85-20SUR MICROCHIP(美国微芯) LCSC C2693737 Extended Part ATTINY85-20SUR

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