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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD SpeakerChip_V_1_0
Mode: Editors' pick
Chip Centered around the LM358 Dual Op-Amp Chip
PCB_SpeakerDriver_RegulatorChip_V_1_0
Open in EditorPCB_SpeakerDriver_RegulatorChip_V_1_0_2
Open in EditorID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | BD140 | Q2,Q3 | TO-126_L7.5-W2.5-P2.3-B | 2 |
2 | 10K | R4 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 1 |
3 | Screw terminal 1 x 02(2pin) | VCC,VEE,SIGIN,SIGOUT | 2PIN (2.54MM) | 4 |
4 | 1000uF | C1,C2 | CAP-TH_BD12.5-P5.00-D1.2-FD | 2 |
5 | 1K | R3 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 1 |
6 | 472M 1KV | C3 | CAP-TH_L5.0-W4.0-P5.00-D1.0-FD | 1 |
7 | LM358P | U1 | DIP-8_L9.4-W6.4-P2.54-LS9.1-BL | 1 |
8 | 10 | R5 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 1 |
9 | 1M | R1,R2 | RES-TH_BD2.4-L6.3-P10.30-D0.6 | 2 |
10 | BD139 | Q1,Q4 | TO-126_L7.5-W2.5-P2.3-B | 2 |
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