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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2022-10-05 12:02:05
Creation time: 2020-02-16 15:36:56
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ID Name Designator Footprint Quantity
1 102 C1,C2,C3,C4,C5,C6,C7,C8 RAD-0.1 8
2 1u C10 RAD-0.1 1
3 1u C11 CAP-D3.0XF1.5 1
4 10u C24 CAP-D3.0XF1.5 1
5 DC5.5/2.5 CN1 DC5.5/2.5 1
6 LED-3MM LED1 LED-3MM/2.54 1
7 IRFP260 Q1,Q2,Q3,Q4,Q5,Q6,Q7,Q8 -TO-247AC 8
8 4.7k R1,R2,R3,R4,R5,R6,R7,R29 AXIAL-0.4 8
9 22k R8 AXIAL-0.4 1
10 1k R9,R10,R11,R12,R13,R14,R15,R16,R17,R18,R19,R20,R21,R22,R23,R25,R26,R27,R28,R31,R35,R36,R52,R55,R56 AXIAL-0.4 25
11 5K R24 R09-5KΩ 1
12 220k R30,R32,R33,R34,R37,R38,R53,R54 AXIAL-0.4 8
13 0.15R R41,R42,R43,R45,R46,R47,R48,R49 AXIAL-1.2 8
14 10k R51 AXIAL-0.4 1
15 LM324 U1,U3 DIP14 2
16 L7812 U2 TO-220(TO-220-3) 1
17 TL431 U4 TO-92(TO-92-3) 1

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