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2.The process supports design scales of 300 devices or 1000 pads

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD SW6V2A-24V

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Update time: 2021-04-11 01:47:25
Creation time: 2016-12-09 04:47:39
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ID Name Designator Footprint Quantity
1 PIC16F1578-I/SO U1 SOIC20 1
2 180R R1,R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R12 R3 12
3 SIP3 CON3,CON4,CON5,CON6,CON7,CON8 HDR1X3 6
4 MBRA140 D1 DO35-7 1
5 BAS16 D2,D3,D4,D5,D6,D7,D8,D9,D10,D11,D12,D13 DO35-7 12
6 HDR2X2 CON1,CON2 HDR2X2 2
7 LM78L05 REG1 TO220 1
8 10-22uf C1 CP_8X13MM 1
9 10-22uF C2 CP_8X13MM 1
10 100nF-1uF C4 C1 1
11 ICSP CON9 HDR1X6 1
12 10K R19 R3 1
13 MCP2003A-ESN U2 SOIC8 1
14 4K7 R15,R14 R3 2

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