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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD MODULO 555 CON CD4017 EGV2021
License: Dominio publico
Mode: Editors' pick
PANELIZADO CD4017 - SEP2021
Open in EditorCLON PANELIZADO LISTO 2021
Open in EditorPCB_MODULO 555 CON CD4017 EGV2021_3
Open in EditorID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | 1u | C1,C2 | CAP-D5.0×F2.0 | 2 |
2 | pwr | H1 | HDR-2X1/2.54 | 1 |
3 | LED | L1,L2,L3,L4,L5,L6,L7,L8,L9,L10 | LED-3MM/2.54 | 10 |
4 | 1k | R1 | AXIAL-0.4 | 1 |
5 | 100 | R2 | RES-ADJ_3386P | 1 |
6 | 1k | R3,R4 | AXIAL-0.3 | 2 |
7 | NE555P | U2 | DIP-8_L9.8-W6.6-P2.54-LS7.6-BL | 1 |
8 | CD4017BE | U3 | DIP-16_16P-L20.2-W6.6-P2.54-LS7.6-BL | 1 |
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