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2.The process supports design scales of 300 devices or 1000 pads

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STD Norand FEC5

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Update time: 2019-12-02 01:10:53
Creation time: 2019-09-17 22:02:34
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ID Name Designator Footprint Quantity
1 DLR1414 U4_1,U5_1,U7_1,U6_1 DLR1414 4
2 CD4503BE U2_1,U1_1,U3_1,U4 DIP16 4
3 74HC42 U9_1 DIP-16 1
4 a H2_1,H6_1,H5_3,H1_3,H2_3,H4_3 210S-1X8P 6
5 Header-Male-2.54_1x8 H3_1,H5,H2,H4,H1,H3,H6,H3_3 210S-1X8P 8
6 74HC374 U8_1,U10_1 NONE 2
7 SN74HC139N U14 DIP-16 1
8 CDP1802 U7 NONE 1
9 DB15 JP1 DB15MC 1
10 MM74C941 U8,U2 NONE 2
11 100K RN2 R_ARRAY_SIP8 1
12 DIP14 DCDC1 DIP14-2.54-17.24X6.35MM 1
13 2.2K RN6 1X10 1
14 74LS175 U17,U23 ~ 2
15 RPACK-SIP-PTH-10 RN1 RPACK-SIP-PTH-5 1
16 22k R2 AXIAL-0.3 1
17 100k RN5_1,RN5_2,RN5_3,RN5_4,RN5_5 AXIAL-0.3 5
18 MC74HC175D U3 751B-05_N 1
19 2732 U11 DIP24-600 1
20 2764 U13,U12 NONE 2
21 CON S1 ~ 1
22 MC14106BCP U5 DIP14 1
23 MC14556BCP U19 DIP16 1
24 MC14049UBCP U18 DIP16 1
25 TL064BCDE4 U1 SOIC14N 1
26 CD4071BCN U20 DIP14 1
27 CD4023BCN U16 DIP14 1
28 MC14013BCP U9 DIP14 1
29 MC14073BCL U10 DIP14 1
30 HD74HC08P U15 DIP14 1
31 SN74HC175N U31_3 DIP-16_300MIL 1
32 M1-6514-5 U1_3,U2_3,U4_3,U24 DIP-18_L22.8-W6.4-P2.54-LS9.4-BL 4
33 MCM4517P15 U14_3,U15_3,U16_3,U17_3,U18_3,U19_3,U20_3,U21_3,U12_3,U11_3,U10_3,U9_3,U8_3,U7_3,U6_3,U5_3 DIP-16_16P-L20.2-W6.6-P2.54-LS7.6-BL 16
34 74HC374 U23_3 DIP20 1
35 HD74HC157P U22_3,U13_3 DIP16 2
36 MC14001BCP U26_2,U26_3,U26_4,U26_1 DIP14 4
37 SN74LS00D U27_4,U27_1,U27_2,U27_3 SOIC14N 4
38 CD4071BCM U29_4,U29_2,U29_1,U29_3 SOIC14N 4
39 MC14081BCL U24_3,U24_1 DIP14 2
40 XCD4049U U28_3,U28_1,U28_2,U28_4 DIP16-2X2-HR 4
41 MC14075BCL U25_1,U25_3 DIP14 2
42 CD4520BE U30_3,U30_1 DIP16 2

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