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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD ESP8266 mashinki

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Update time: 2019-03-04 21:27:48
Creation time: 2018-12-16 19:05:54
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ID Name Designator Footprint Quantity
1 LoLin_NodeMCU U6 LOLIN NODEMCU 1
2 DIP switch SW1 DSWB02LHGET 1
3 m24c08-rdw6tp U7 SOIC-8_150MIL 1
4 4052 U5 SOP-16_150MIL 1
5 15k R4,R3 AXIAL-0.3 2
6 4.7k R10,R9 AXIAL-0.3 2
7 0.1u\50v C4,C6 1206 2
8 AMS1117-3.3 U2 SOT-223 1
9 16k* R7 AXIAL-0.3 1
10 1k* R8 AXIAL-0.3 1
11 1N4007 D1 DO-35 1
12 1k R1,R6 AXIAL-0.3 2
13 PC817 U4,U3 DIP-4 2
14 1N4007 D3 DO-41 1
15 KA278R05 U1 TO-220-4_VERTICAL 1
16 10k* R5 AXIAL-0.3 1
17 30k* R2 AXIAL-0.3 1
18 0.1u\50v C2 RAD-0.1 1
19 10u\16v C3,C5 CAP-D3.0XF1.5 2
20 JQ6500-16P U9 JQ6500-16P 1
21 4.7uF/50v C8,C7,C11,C12,C9,C10 CAP-D3.0XF1.5 6
22 100uF\50v C13 CAP-D3.0XF1.5 1

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