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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD Project Wei Jing

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Update time: 2020-10-22 05:27:09
Creation time: 2018-09-24 19:37:13
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ID Name Designator Footprint Quantity
1 1m L1,L2,L3,L4,L5,L6,L7,L8 AXIAL-0.4 8
2 15nF C14 CAP-CBB-6.5*4.0 1
3 1u C1,C2,C3,C7,C8,C9,C10,C12 RAD-0.1 8
4 1uF C4,C5 RAD-0.1 2
5 2uF C6 RAD-0.1 1
6 1k R1,R2,R3,R20,R21 AXIAL-0.3 5
7 R1 R4,R9,R11,R12,R14,R16 AXIAL-0.3 6
8 R2 R5,R6,R7,R8,R10,R13,R15,R17 AXIAL-0.3 8
9 R3 R18 AXIAL-0.3 1
10 R4 R19 AXIAL-0.3 1
11 100k R22,R23,R24,R25,R26,R27,R28,R29 AXIAL-0.3 8
12 NTD4904NT4G Q1,Q2 TO-252-2 2
13 ATMEGA328P-MU U10,U13 QFN-32_5X5X05P 2
14 12V 3A LED1,LED2 LED-3MM/2.54 2
15 100uF C11,C13,C16,C17,C19,C20,C21,C22,C23,C24,C26 CAP-D4.0XF1.5 11
16 200uF C15 CAP-D4.0XF1.5 1
17 50uF C18 CAP-D4.0XF1.5 1
18 100V 150uF C25 CAP-D4.0XF1.5 1
19 BS-2-1 B1,B2,B3,B4 BATTERY-1 4
20 LM358 U2,U1,U3,U4,U5,U6,U7,U8,U9,U11,U12 DIP08-KIT 11

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